Technologies for high-vacuum thin-film coating applications
Deposition of layers to improve a materialPhysical vapor deposition (PVD) with thermal or electron-beam evaporation as well as sputtering uses a rigid deposition material source. However, where our systems use chemical vapor deposition (CVD), gases or liquid material sources are used.
We offer the complete spectrum of vacuum thin-film deposition technologies, from evaporation, sputtering, plasma-enhanced chemical vapor deposition (PECVD) and enhancements of the technologies such as plasma-assisted reactive magnetron sputtering (PARMS). For mass production systems several in-situ process control systems are available. Our systems can coat tiny substrates of a few millimeters to extremely large glass panes of more the 20 m² for use in architecture. The substrates can be rigid or flexible as in food packaging or electronic capacitor manufacturing.